System Overview

The Light Injection System generates and couples light into the Fiber‑Optic Display Core of the FOS‑WDP‑S1 Smart Wall Display Panel. High‑brightness RGB LED arrays or RGB laser arrays mounted along the top and bottom edges inject controlled illumination into the micro‑fibre optical matrix.

The system is fully CPU‑controlled through constant‑current driver circuits, enabling precise brightness regulation, colour mixing, scene rendering, and dynamic lighting effects.

• Uniform full‑width light injection
• High optical efficiency
• Accurate RGB colour reproduction
• Stable brightness control
• Low thermal distortion
• Long operational life
• Modular serviceability
• Passive cooling

Design Objectives

• Uniform light injection
• High optical efficiency
• Accurate RGB colour reproduction
• Stable brightness and colour control
• Low thermal distortion
• Long‑term reliability
• Modular replaceability
• Efficient passive cooling

Global Dimensions

• Panel Width: 2000 mm
• Panel Height: 1200 mm
• Top Injection Module Length: 2000 mm
• Bottom Injection Module Length: 2000 mm
• Module Height: 20 mm
• Module Depth: 15 mm
• Number of Rails: 2 (top and bottom)

System Architecture

• Top RGB injection module
• Bottom RGB injection module
• RGB LED or RGB laser arrays
• Optical coupling interface
• Constant‑current driver circuits
• Flexible Printed Circuit (FPC) interconnections
• Thermal management assembly
• CPU‑controlled illumination system

Light Source Options

Option A — RGB LED Arrays

• High‑brightness surface‑mount LEDs
• Linear edge‑mounted array
• High reliability
• Long service life
• Excellent colour control
• Lower cost and maintenance

Option B — RGB Laser Arrays

• Solid‑state RGB laser modules
• Linear edge‑mounted array
• Higher optical intensity
• Narrow spectral output
• Excellent colour saturation
• Greater optical efficiency
• Enhanced long‑distance propagation

Optical Coupling System

• Material: Optical‑grade PMMA
• Method: Precision‑machined optical interface
• Function: Transfers light into the micro‑fibre matrix with minimal loss
• Alignment Tolerance: ±0.10 mm

Driver Electronics

• Driver Type: Constant‑current driver ICs
• Location: Main Electronics Bay
• Control: CPU‑controlled
• Brightness: PWM + current regulation
• Colour Mixing: Independent RGB channels

Protection Features

• Over‑current protection
• Short‑circuit protection
• Thermal monitoring
• Open‑load detection

Electrical Specifications

• Input Voltage: 12 V DC
• Driver Supply Voltage: 12 V DC
• Logic Voltage: 3.3 V DC
• Communication: PWM, GPIO
• Power Consumption: Brightness‑dependent

Thermal Management

• Cooling Method: Passive conduction
• Components: Aluminium heatsinks, thermal pads
• Heat Path: Light source → heatsink → thermal pad → rear structural plate → ambient air

Flexible Printed Circuit (FPC)

• Material: Polyimide
• Conductors: High‑current copper traces
• Connections: Mainboard, driver ICs, injection modules
• Routing: Integrated frame cable channels
• Minimum Bend Radius: 5 mm

Light Control System

• Brightness: Automatic, manual, adaptive
• Colour Control: Independent RGB channels
• Scene Rendering: CPU + firmware controlled
• Dynamic ambient lighting profiles supported

Internal Signal Path

• CPU → Driver ICs → PWM → Current Regulation → RGB Light Source → Optical Coupler → Display Core → Viewer

Optical Performance

• Uniform illumination
• Minimal leakage
• Low attenuation
• High colour uniformity
• Stable brightness
• Wide dynamic range
• Low flicker
• High optical efficiency

Environmental Specifications

• Operating Temp: 0°C to 50°C
• Storage Temp: −20°C to 70°C
• Humidity: 10%–90% RH
• UV Resistance: High
• Service Life: > 50,000 hours

Mechanical Specifications

• Housing: Extruded aluminium
• Finish: Black anodised
• Mounting: Precision alignment brackets
• Fasteners: Stainless steel
• Alignment: Factory calibrated
• Service Access: Rear electronics compartment

Manufacturing Sequence

1. Manufacture aluminium housings
2. Install RGB LED or laser arrays
3. Install driver PCBs
4. Fit heatsinks
5. Apply thermal pads
6. Install optical couplers
7. Mount modules to display core
8. Connect FPC assemblies
9. Connect driver circuits
10. Verify optical alignment
11. Perform thermal testing
12. Test illumination uniformity
13. Complete electrical testing
14. Final QA

Quality Assurance

• Optical alignment
• Colour uniformity
• Brightness uniformity
• Electrical continuity
• Driver communication
• Thermal performance
• Mechanical alignment
• Coupling efficiency

Serviceability

Serviceable Components

• RGB LED/Laser modules
• Driver PCBs
• Flexible Printed Circuits
• Thermal pads
• Heatsinks
• Mounting brackets

Non‑Serviceable Components

• Factory‑machined optical couplers
• Integrated optical alignment features

Material Specification

Performance Characteristics

• High optical coupling efficiency
• Uniform full‑width injection
• Stable RGB output
• High brightness
• Low flicker
• Passive thermal stability
• Long‑term reliability
• Modular serviceability

System Integration

• MBP‑004 — Fiber‑Optic Display Core
• MBP‑006 — Intermediate Structural Plate
• MBP‑007 — Rear Structural Back Plate
• MBP‑009 — Mainboard & CPU Subsystem
• MBP‑010 — Power Supply Subsystem
• MBP‑015 — Power & Thermal Management
• MBP‑018 — Firmware & Software Architecture

Design Requirements

• Controlled RGB illumination
• Precise optical alignment
• Efficient light coupling
• Stable colour and brightness
• Effective passive cooling
• Reliable communication with mainboard
• Easy maintenance of replaceable components
• Compatibility with all related subsystems