FOS‑WDP‑S1 — Mainboard & CPU Subsystem
MBP‑009 — Master Blueprint Package
Fiber‑Optic Smart Wall Display Panel
System Overview
The Mainboard & CPU Subsystem is the central processing and control hub of the FOS‑WDP‑S1 display system. It integrates the CPU, chipset, memory subsystem, PCIe expansion, storage interfaces, power delivery, networking, audio, USB connectivity, and firmware support into a single high‑performance PCB.
The mainboard uses a 10‑layer FR‑4 PCB engineered for signal integrity, power distribution, thermal stability, and long‑term reliability.
Mainboard Dimensions
| Parameter | Value |
|---|---|
| Board Length | 320.0 mm |
| Board Height | 230.0 mm |
| PCB Thickness | 2.0 mm ±0.15 mm |
| PCB Layers | 10 Layers |
| Form Factor | Custom 320 × 230 mm |
Mainboard Components
- Intel LGA‑4677 CPU Socket
- 8 × DDR5 DIMM Slots
- VRM Power Stage
- 24‑pin ATX Power Connector
- 2 × PCIe 5.0 ×16 Slots
- 4 × M.2 NVMe Slots
- 6 × SATA III Ports
- USB 3.2 Header
- Front Panel Header
CPU Socket
| Parameter | Value |
|---|---|
| Socket Type | Intel LGA‑4677 |
| Width | 56.4 mm |
| Height | 78.0 mm |
| Contact Pitch | 0.60 mm |
| Pitch | 1.27 mm |
| Maximum CPU TDP | 350 W |
| Mounting | Four‑point metal retention |
Memory Subsystem
- 8 × DDR5 DIMM Slots
- 2DPC Support
- Quad‑Channel Architecture
| Parameter | Value |
|---|---|
| Memory Type | DDR5 ECC UDIMM / RDIMM |
| Slots | 8 |
| Channels | Quad Channel |
| Maximum Capacity | 2 TB (8 × 256 GB) |
| Maximum Speed | 5600 MT/s |
| Operating Voltage | 1.1 V |
- DIMM Max Height: 48 mm
- DIMM Length: 133.3 mm
Power Delivery (VRM)
The VRM subsystem includes:
- Digital PWM Controller
- 18 + 2 + 1 Power Phases
- 90 A Smart Power Stages
- Solid Capacitors
- Dual 8‑pin CPU Power Connectors
Designed for high stability, heavy processing loads, and overclocking support.
System Block Diagram
- DDR5 Memory
- PCIe Devices
- CPU (Intel LGA‑4677)
- Southbridge (Intel W790 PCH)
- SATA III
- USB 3.2
- Audio Codec
- Front Panel
- ATX / VRM Power
Rear I/O Panel
- Clear CMOS Button
- USB 3.2 Gen2×2 Type‑C
- USB 3.2 Gen2 Type‑A (4)
- USB 2.0 Type‑A (2)
- Dual 2.5G LAN Ports
- Wi‑Fi 7 Antenna Connectors
- Audio Jacks (5 + 1)
- Optical S/PDIF
- HDMI 2.1
- DisplayPort 1.4
M.2 NVMe Storage
| Parameter | Value |
|---|---|
| Length | 110.0 mm |
| Width | 22.0 mm |
- Supports 2242 / 2260 / 2280 / 22110
- PCIe 5.0 ×4 Interface
- Up to 128 Gb/s
- Integrated M.2 Heatsink
PCB Stack‑Up
| Layer | Description |
|---|---|
| L1 | Top Signal |
| L2 | GND Plane |
| L3 | Internal Power |
| L4 | Internal Signal |
| L5 | GND Plane |
| L6 | Internal Signal |
| L7 | Internal Power |
| L8 | GND Plane |
| L9 | Bottom Signal |
| L10 | Bottom Signal |
Environmental Specifications
| Parameter | Value |
|---|---|
| Operating Temperature | 0°C to +70°C |
| Storage Temperature | −40°C to +85°C |
| Humidity | 10–90% RH (Non‑condensing) |
| MTBF | >150,000 Hours |
| ESD Protection | ±8 kV Contact / ±15 kV Air |
| Compliance | RoHS, REACH, CE, FCC |
Mainboard Specifications
| Item | Specification |
|---|---|
| Form Factor | Custom 320 × 230 mm |
| CPU | Intel Xeon W‑3500 / W‑3400 Series |
| Chipset | Intel W790 (PCH) |
| Memory | DDR5 ECC RDIMM / UDIMM |
| PCIe Expansion | 2 × PCIe 5.0 ×16 |
| Storage | 4 × M.2 NVMe + 6 × SATA III |
| USB | USB 3.2 Gen2×2 / Gen2 / USB 2.0 |
| LAN | Dual 2.5 Gb Ethernet |
| Audio | 7.1 HD Audio (Realtek ALC4082) |
| Power Input | 24‑pin ATX + 2 × 8‑pin EPS |
Design Features
- High‑performance server/gaming‑grade PCB
- 10‑layer PCB for signal integrity
- Advanced VRM cooling with heatsinks
- Overclocking‑ready power architecture
- Multiple M.2 slots with thermal guards
- Quad‑channel DDR5 memory
- Dual 2.5G LAN
- Extensive USB connectivity
- Front‑panel debug LED support
Protection Features
- Over‑voltage protection (OVP)
- Under‑voltage protection (UVP)
- Over‑current protection (OCP)
- Short‑circuit protection (SCP)
- Over‑temperature protection (OTP)
- ESD protection on all ports
- Power‑good and reset circuits
Manufacturing & Quality
Manufactured to:
- IPC‑A‑600 Class 2 PCB Standard
- IPC‑A‑610 Class 2 Assembly Standard
Quality Procedures
- 100% AOI inspection
- X‑ray inspection of BGA devices
- In‑Circuit Test (ICT)
- Functional testing
- Serial number traceability
Performance Highlights
- High‑performance CPU support
- Quad‑channel DDR5 memory
- PCIe 5.0 ultra‑fast expansion
- Multiple NVMe storage options
- Advanced VRM power design
- 10‑layer PCB construction
- Dual 2.5G LAN
- Premium HD Audio
- Extensive I/O connectivity
- Enterprise‑grade reliability
Blueprint Access & Licensing
MBP‑009 — Mainboard & CPU Subsystem is part of the complete multi‑volume engineering blueprint package for the FOS‑WDP‑S1 Fiber‑Optic Smart Wall Display Panel.
Contact Blueprints Market for licensing, integration support or enterprise‑level deployment.
