System Overview

The Rear Back Plate is the primary structural chassis, heat‑spreader and mounting interface for the FOS‑WDP‑S1 Smart Wall Display Panel. It forms the rear-most layer of the assembly, providing mechanical strength, thermal stability, electronics enclosure support and full compatibility with commercial mounting systems.

Global Dimensions

• Overall Size: 2000 mm × 1200 mm
• Rear Plate Thickness: 10.0 mm
• Total Assembly Thickness: 30.0 mm

Rear Back Plate

• Material Options: Brushed Aluminium or Steel‑Reinforced Composite

Primary Functions

• Main chassis
• Heat spreader
• Structural support
• Electronics enclosure
• Wall mounting interface

Structural Features

• Integrated mounting bosses
• Service openings
• Electronics bay interface
• Cable routing attachment points
• Frame fastening locations

Thermal Management

The rear back plate acts as the primary heat spreader for the CPU, power supply, LED modules and audio amplifiers. Thermal pads provide conductive transfer to the plate, enabling passive convection across the rear surface.

Mounting System

• Supports VESA‑compatible mounting
• Supports rear rail mounting systems
• Designed to distribute structural loads across the chassis

Materials

• Rear Plate: Brushed Aluminium / Steel Composite
• Threaded Inserts: Stainless Steel
• Fasteners: Stainless Steel

Manufacturing Sequence

1. Machine rear plate
2. Install threaded inserts
3. Machine service openings
4. Apply surface finish
5. Inspect flatness
6. Assemble with perimeter frame
7. Perform dimensional verification
8. Perform thermal verification

Design Requirements

• High rigidity
• Low deflection
• Corrosion resistance
• Long service life
• Thermal stability
• Service accessibility